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Home » Products » SMD Rework Station » Infrared BGA Rework Station

Infrared BGA Rework Station

Infrared BGA Rework Station
Infrared BGA Rework Station
Product Code : ASC 19
Brand Name : ASCOMP INC.
Product Description

Technical Specification :

Model

KID-R600

Max PCB size

W550mm x D500mm

PCB Thickness

0.5~2.5mm

Components

1x1~70x70mm

Min. IC Pitch

0.15mm

Max.Mounting Weight

500g

Mounting Accuracy

+0.01mm

PCB Fixing Way

Outer

Working Table Fine-Adjusting

forward/backward +15mm,left/right +15mm

Temperature Controlling Way

K-Type thermocouple, closed loop control

Lower Hot Air Heating

Hot Air 800W

Upper Hot Air Heating

hot air 1200W(110V)

Bottom Pre-Heating

IR 3600W

Power

Single Phase 220V,A50/60 Hz

Machine Size

L850mm x W750mm x H630mm

Machine Weight

Approx 80 Kgs


ASCOMP INC.

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