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BGA Machine

BGA Machine
BGA Machine
Product Code : KID-R600
Brand Name : KID
Product Description

Model : KID-R600 

KID-R600 is a style of rework station that is with optical location system and soldering and desoldering in one, used for soldering and desoldering all kind of components.

Features: 

  • Heating head and mounting head 2 in 1, driven by stepping motor, can solder and unsolder automatically.
  • Upper heating head is a new type product with mix IR and hot air heating, temperature goes up quickly that creates big temperature difference between BGA removed and the components around that will remain unaffected, suitable best for the chip with very small space between BGA.
  • Three heating zone (upper hot air + lower hot air + bottom IR) heat separately, the time and the temperature displayed on the touch screen.
  • 7.2 inch high resolution touch screen for visible operation and observation.
  • Large and movable bottom pre-heats area, PCB fixing jig is adjustable with X, Y axes, the max PCB size is up to 550*500mm.
  • Bottom power cross flow fan cooks down instantly and safely.
  • Colors optical vision system with prismatic double colors, zoom in and fine adjusting functions, aberration distinguish setting is included, auto-focus, software operation, 27x optical zoom, Max BGA size 70*70mm can be reworked.
  • Embedded industrial computer, touch screen interface, PLC control, display real-time temperature curve as well as setting curve and practically-test curve which can be analyzed.
  • Built-in vacuum pump, rotate within 60▫<, mounting nozzle with precise fine adjusting.
  • 8 segments temperature up (down) + 8 segments constant temperature control, temperature curve can be carried out on touch screen.
  • Nozzle can detect the heights when picking and placing, the pressure is controllable in very small range.
  • Many sizes alloy hot air nozzle to be replaced easily and located in any angels.
  • Colors optical vision system moved automatically with jigs with locating scales.
  • Temperature testing pot, real-time monitoring and analyzing.

Technical Specification :

Model

KID-R600

Max PCB size

W550mm x D500mm

PCB Thickness

0.5~2.5mm

Components

1x1~70x70mm

Min.IC Pitch

0.15mm

Max.Mounting Weight

500g

Mounting Accuracy

+0.01mm

PCB Fixing Way

Outer

Working Table Fine-Adjusting

forward/backward +15mm,left/right +15mm

Temperature Controlling Way

K-Type thermocouple, closed loop control

Lower Hot Air Heating

Hot Air 800W

Upper Hot Air Heating

hot air 1200W(110V)

Bottom Pre-Heating

IR 3600W

Power

Single Phase 220V,A50/60 Hz

Machine Size

L850mm x W750mm x H630mm

Machine Weight

Approx 80 Kgs


ASCOMP INC.

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